NEXT Biometrics

NEXT Biometrics

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Enabled by its patented NEXT Active Thermal principle, NEXT Biometrics ( offers high quality area fingerprint sensors at a fraction of the prices of comparable competitors. A wide range of product formats including Smartphones, Tablets, PC’s, Doors, Time registration systems, Wearables, Payment terminals, Flashdrives, USB-tokens, Key fobs and many more are targeted. NEXT BIOMETRICS GROUP ASA is a publicly listed company headquartered in Oslo, Norway and with sales, support and development subsidiaries in Seattle, Silicon Valley, Taipei, Prague and Shanghai.

The NEXT Advantage

The NEXT Active Thermal principle has a simple and robust implementation. This ensures a unique fit with the production processes of major high-end display fabs: Thin Film Semiconductor Technologies such as LTPS.

Using production processes common to LTPS production facilities, NEXT today manufactures robust design fingerprint sensors at a fraction of competing sensor cost levels.

The Sensing Principle

The Active Thermal Sensing Principle is based on heat transfer. A low power heat pulse is applied to each sensor pixel over a short period of time and a response is measured. This response is quite large and different for pixels in proximity to a finger’s ridge or valley.

Our custom ASIC is capable of reading, processing and communicating these signals in a high quality image to the host system. All this is done in a very short period of time and with the user not feeling any heat.

The Production Process

The highly robust analog signal created by our sensors and the simplicity of our pixel designs allow for a unique fit with large area production processes such as LTPS Thin Film Transistors and Devices (LTPS: Low Temperature Poly Silicon).

NEXT has performed extensive fundamental research, including semiconductor device studies of LTPS components. Our technical team has also developed designs and systems that further enhance the merger of our sensing principle with LTPS production technology. After a 2.5 year qualification process of the production facilities in Asia, NEXT now mass produces its sensors in the same production lines used for high-end displays in world brand name smartphones, tablets and PC’s.

The Advantages of Polysilicon

The polysilicon components used to build the active thermal NEXT sensors are robust, high quality, and uniform, yet they are produced over a large surface area and using efficient device structures.  This greatly reduces their cost per area when compared to common silicon semiconductor processes.

Many competing capacitive sensor designs are more complex at the pixel level, particularly when considering larger area sensors. This unique fit to a low cost high quality production process constitutes a unique opportunity for NEXT BIOMETRICS.

Module Level Competitiveness

The NEXT product delivery formats are normally in modules consisting of the sensor, a small ASIC (Application Specific Integrated Circuit ) and some miscellaneous components.  The sensor level competitiveness in combination with the NEXT ASIC allows for the manufacture of complete modules at a fraction of competition cost levels.

The NEXT ASIC includes high performance analog signal processing. The image from the active sensor area is processed by proprietary circuits and techniques developed through research. They are custom designed and specially targeted to our sensor and the production process.

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